Reflow Tin Plating


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Reflow Tin Plating

Reflow tin plating is an electrodeposit process that has exceptional solderability compared to conventional electroplated tin. This exceptional behaviour is attributed to a pure, dense, porosity-free structure that exhibits slower copper-tin intermetallic compound growth and reduced surface oxidation. Additional benefits of a reflowed tin metallization include uniform tin distribution, lead free deposit, no tin whiskers, improved insertion force and excellent formability during stamping.

Capabilities:
Process - Continuous Coil
Preplates - Copper and Nickel

 

Reflow Tin Plating

 




1150 Nicholson Road, Newmarket, Ontario, Canada L3Y 9C4
Phone: (905) 830-4007  Fax: (905) 830-1844
Email: sales@cooperplating.com

Copyright 2001 - 2008 Cooper Plating Inc. - Electroplating