Reflow tin plating is an electrodeposit process that has exceptional solderability compared to conventional electroplated tin. This exceptional behaviour is attributed to a pure, dense, porosity-free structure that exhibits slower copper-tin intermetallic compound growth and reduced surface oxidation. Additional benefits of a reflowed tin metallization include uniform tin distribution, lead free deposit, no tin whiskers, improved insertion force and excellent formability during stamping.
Process - Continuous Coil
Preplates - Copper and Nickel